The films are produced by laminating rigid PVC to polyethylene (PE), then coating the substrate with Diofan Super B. Multiple layers can be applied to generate different coating weights
ACG Films has invested to expand its series of high barrier blister films.
The company’s UltraSafe portfolio is now available in three variants of varying thicknesses providing customisable protection against moisture and oxygen for oral solid dose products.
These are: UltraSafe Dupac, which comprises PVC and PVdC, while UltraSafe Tripac is made with these two substrates plus a layer of PE in between. The third product, Core, comprises a layer of PVdC sandwiched between two layers of PVC. The symmetry of the sandwiched structure offers higher machinability due to the presence of the same seal surface on both sides of the structure, AGC says. In each product, the barrier properties of Diofan Super B reportedly provides long-term safety even in demanding climatic conditions.
The company claims in addition to safeguarding against moisture and oxygen, UltraSafe films prevent the loss or unwanted addition of aroma and flavour. It says its films offer strong seal integrity achievable even at high speeds and require no special tooling.
Ultrasafe films also reportedly offer the ability to reduce pack sizes or increase pill density without enlarging the package. Blister pack size can be reduced up to 60%, significantly decreasing the amount of packaging material required for both cost savings and improved eco-friendliness.
The films also mitigate blister curling issues post-thermoforming, diminishing the need for rib stiffening. The lower forming temperatures also enable better production control, as do its high levels of elasticity.
The films can be produced using tools or molds designed for PVC or regular PVDC coated films.
Ultrasafe film’s parameters for key production criteria like thermoforming temperature, molding pressure and sealing requirements are the same as regular PVdC-coated films, meaning no special tech training is necessary.